US Patent 7697269 Housing mechanism for electronic device

An exemplary housing mechanism (8) for an electronic device includes a cover (10) and a frame (20). The cover has a cover body (11), a sealing element (12), and a sidewall (13) formed around the cover body. A surface of a distal end of the sidewall is recessed thereby forming a receiving slot (16) therein. The sealing element has a connecting portion (122) and a positioning portion (124) connected to the connecting portion. The connecting portion is fixedly received in the receiving slot of the cover. The frame has a positioning slot (26) defined therein and the positioning portion of the sealing element is for reception in the positioning slot of the frame when the cover is closed to the frame.