US Patent 7700406 Methods of assembling integrated circuit packages
Patent 7700406 was granted and assigned to Micron Technology on April, 2010 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 28, 2007
0
Date of Patent
April 20, 2010
0
Patent Application Number
11770451
0
Patent Inventor Names
Tongbi Jiang
0
Lim Thiam Chye
0
Setho Sing Fee
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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