Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 20, 2010
Patent Application Number
11292694
Date Filed
December 2, 2005
Patent Primary Examiner
Patent abstract
A method for forming interconnections within a column grid array is provided. The method involves casting one or more columns with at least a compliant core material that increases flexibility between an electronic component and a printed wiring board by at least a factor of two over metallic-based solder columns, and forming the one or more columns to length for interconnecting between the electronic component and the printed wiring board. The method also involves forming a conductive material for the one or more columns to provide electrical interconnection between the electronic component and the printed wiring board.
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