Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hitoshi Abiko0
Date of Patent
April 20, 2010
Patent Application Number
11712976
Date Filed
March 2, 2007
Patent Primary Examiner
Patent abstract
A backside imaging device includes a bump that is disposed overlapping with a sensor array region or a photodiode in a planar view. By this configuration, the bump becomes a support, and the semiconductor substrate is prevented from being damaged because of a bending applied to the semiconductor substrate.
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