Patent attributes
A power semiconductor module 3 for mounting on a cooling element 4 has at least one substrate 2, on which one or more components 5, 6, 7 are mounted and a module housing 40. The module housing 40 surrounds at least partially the at least one substrate 2. The module housing 40 has opposite sides with a first side facing the cooling element 4, and a second side 42 having one or more openings and a surface turned away from the power semiconductor module 3. Each of the one or more openings has a border, which is sealed by an internal contact 16, 17, 18, 27, 28, which is electrically connected to the one or more components 5, 6, 7. The internal contact protrudes the module housing 40, such that the internal contact not extends beyond said surface of the second side 42 of the module housing 40.
