US Patent 7701252 Stacked die network-on-chip for FPGA

A programmable device system includes one or more network-on-chip (NoC) die layers vertically connected to one or more programmable chip dice layers. The NoC die layer includes interconnects, a bus or non-blocking switches, and optionally memory blocks and direct memory access engines. The NoC die layer improves on-chip communications by providing fast and direct interconnection circuitry between various parts of the programmable chip die.