US Patent 7701743 Electronic circuit package
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Patent abstract
An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor.
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Patent Inventor Names
Hirokazu Ihara0
Hisayoshi Yamanaka0
Kiyoshi Kawabata0
Masatsugu Akiyama0
Nobuyasu Kanekawa0
Tetsuya Okishima0
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US Patent 07701743 Electronic circuit package US Patent 7701743 Electronic circuit package
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Patent Number
07701743
Patent Number
7701743
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Official Website
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US Patent 07701743 Electronic circuit package
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Is a
Patent jurisdiction
Patent number
07701743
Date of patent
April 20, 2010
Patent application number
12222329
Date Filed
August 7, 2008
Patent primary examiner
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