Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 20, 2010
Patent Application Number
11554259
Date Filed
October 30, 2006
Patent Primary Examiner
Patent abstract
A semiconductor device includes a plurality of bonding pads as bonding option, and a test circuit for performing an operation test using particular bonding pads and testing interconnects connecting internal circuits to the remaining bonding pads which are not used in the operation test.
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