US Patent 7703069 Three-dimensional mask model for photolithography simulation
Patent 7703069 was granted and assigned to Brion Technologies on April, 2010 by the United States Patent and Trademark Office.
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A three-dimensional mask model of the invention provides a more realistic approximation of the three-dimensional effects of a photolithography mask with sub-wavelength features than a thin-mask model. In one embodiment, the three-dimensional mask model includes a set of filtering kernels in the spatial domain that are configured to be convolved with thin-mask transmission functions to produce a near-field image. In another embodiment, the three-dimensional mask model includes a set of correction factors in the frequency domain that are configured to be multiplied by the Fourier transform of thin-mask transmission functions to produce a near-field image.
US Patent 07703069 Three-dimensional mask model for photolithography simulation US Patent 7703069 Three-dimensional mask model for photolithography simulation
US Patent 07703069 Three-dimensional mask model for photolithography simulation
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