Patent 7703722 was granted and assigned to Panduit on April, 2010 by the United States Patent and Trademark Office.
A clamp used to create a bond between under floor wiring systems and a common bonding network. The clamp includes a mounting plate, a U-bolt and a split bolt for securing wires to the mounting plate. The mounting plate has an aperture and a slot. The U-bolt has a first end and a second end. The first end of the U-bolt is attached at the aperture of the mounting plate and the second end of the U-bolt is positioned within the slot of the mounting plate. The second end of the U-bolt is removed from the slot to enable the second end of the U-bolt to pivot away from the mounting plate enabling the U-bolt to engage a floor pedestal.