Patent 7704449 was granted and assigned to Hitachi on April, 2010 by the United States Patent and Trademark Office.
An electrical contact comprising a matrix of an alloy of a high electro-conductive metal and a low melting point metal and particles of a refractory metal dispersed in the matrix. The electrical contact comprises the alloy containing a low melting point metal of at least one of Sn, Te and Be, and the refractory metal is Cr. The alloy comprising the low melting point metal in an amount of 0.5 to 3% by weight and the balance being Cu.