A junction device includes a junction device main portion configured for attachment to an electrical enclosure and a modular device portion electrically coupled to the junction device main portion and configured for electrical coupling to an inner junction of the electrical enclosure. At least one conductive pass-through electrically couples the inner junction of the electrical enclosure to an outer junction of the electrical enclosure. The outer junction is enclosed by an outer enclosure that is configured to engage the electrical enclosure thereby surrounding the outer junction to prevent degradation of a coupled external high-voltage conductor and to provide fire protection.