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US Patent 7705246 Compact differential signal via structure

Patent 7705246 was granted and assigned to EMC on April, 2010 by the United States Patent and Trademark Office.

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Patent attributes

Current Assignee

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Jason Pritchard0

Michael Gnieski0

Date of Patent

April 27, 2010

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Patent Application Number

119658110

Date Filed

December 28, 2007

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Patent Citations Received

US Patent 11765813 Backplane footprint for high speed, high density electrical connectors

US Patent 11950356 Mating backplane for high speed, high density electrical connector

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US Patent 11805595 Backplane footprint for high speed, high density electrical connectors

US Patent 11758656 Backplane footprint for high speed, high density electrical connectors

Patent Primary Examiner

Jeremy C Norris

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Patent abstract

A differential signal via structure for a printed circuit board having a pair of signal vias extending vertically from a surface of the board to an interior region of the board to contact signal conductors disposed horizontally within the interior region of the board and a pair of ground vias extending vertically from a surface of the circuit board to an interior region of the board to contact ground conductors disposed horizontally within the interior region of the board.

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