Patent attributes
The invention relates to a semiconductor switching module for on-board electrical supply systems comprising a plurality of semiconductor chips, and a method for producing the same. The semiconductor switching module has at least one half-bridge circuit comprising a first semiconductor circuit chip as LSS (low side switch) and a second semiconductor circuit chip as HSS (high side switch) on a common circuit structure. The circuit structure includes contact pads on the top side of the circuit structure and lead connections with external contact areas on the underside of the circuit structure and with internal contact areas on the top side of the circuit structure. In this case, at least one of the semiconductor circuit chips is arranged on contact pads of the circuit structure using flip-chip technology and is electrically and cohesively connected to the contact pads by using diffusion solder layers.
