Patent 7706198 was granted and assigned to SAMSUNG ELECTRONICS CO., LTD. on April, 2010 by the United States Patent and Trademark Office.
There is provided a repair method of a multi-chip that comprises a plurality of memory chips, each of the memory chips storing information with respect to remaining redundancy cells after repairing at a chip level. The repair method includes testing one of the plurality of memory chips; when the tested memory chip is judged to be defective, checking whether the tested memory chip is repairable, based on the stored information of the remaining redundancy cells; and when the tested memory chip is judged to be repairable, repairing the tested memory chip.