Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 4, 2010
Patent Application Number
11509268
Date Filed
August 24, 2006
Patent Primary Examiner
Patent abstract
A process and apparatus for making die-dried friction wafers collects friction particulates in a mold defining a wafer. The mold includes at least one perforate wall portion against which an aqueous slurry including the particulates is passed to form at least one layer on the wall as the particulates collect in the mold. The collection is dried followed by curing, and may be cured in the mold by heating.
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