US Patent 7708875 Noncontact localized electrochemical deposition of metal thin films

A method of selectively depositing metal features on a conductive surface of a substrate. An electrode assembly that includes a plurality of electrodes connected in series so as to be oppositely polarized when a voltage is applied thereacross is positioned over the conductive surface of the substrate. The plurality of electrodes is in close proximity to, but does not contact, the conductive surface of the substrate. Positively charged portions and negatively charged portions of the conductive surface of the substrate are created and metal ions are deposited on the negatively charged portions.