US Patent 7709950 Silicon wafer having through-wafer vias
Patent 7709950 was granted and assigned to IceMos Technology on May, 2010 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 2, 2008
0
Date of Patent
May 4, 2010
0
Patent Application Number
12202638
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Patent Inventor Names
Conor Brogan
0
Robin Wilson
0
Hiugh J. Griffin
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Cormac MacNamara
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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