US Patent 7712203 Method of manufacturing a sensor apparatus
Patent 7712203 was granted and assigned to Denso on May, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A sensor apparatus and a method of manufacturing the same are disclosed. The sensor apparatus includes: a sensor chip; a housing receiving the sensor chip; an electric conductive member connected with a terminal of the sensor chip; and a molded member covering a covered portion including a connection portion where the terminal and the electric conductive member are connected. The sensor chip is bonded to a bonding member of the housing via an adhesive member. A surface of the housing, a surface of the adhesive member, and a front surface of the sensor chip are in the same plane at a boundary part of the covered portion.
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US Patent 07712203 Method of manufacturing a sensor apparatus US Patent 7712203 Method of manufacturing a sensor apparatus
Infobox
Patent Number
0771220300
Patent Number
771220300
Edits on 23 Mar, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077122030
Date of Patent
May 11, 2010
0Patent Application Number
123209570
Date Filed
February 10, 2009
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077122030
Date of Patent
May 11, 2010
0Patent Application Number
123209570
Date Filed
February 10, 2009
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
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Edits on 4 Dec, 2021
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US Patent 07712203 Method of manufacturing a sensor apparatus
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07712203
Date of patent
May 11, 2010
Patent application number
12320957
Date Filed
February 10, 2009
Patent primary examiner
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