Patent 7713050 was granted and assigned to NGK Insulators on May, 2010 by the United States Patent and Trademark Office.
A die for forming a honeycomb structure includes a die base having a first plate-like member and a second plate-like member, the first plate-like member is provided with groove portions on the side of a bonding surface between the first plate-like member and the second plate-like member, and a depth y (mm) of the groove portions satisfies:y≦a·(t1×E1+t2×E2)/(t1×t2×E1×E2)where t1 is a thickness (mm) obtained by subtracting the depth (mm) of the groove portions from a thickness (mm) of the first plate-like member, E1 is an apparent volume elasticity (GPa) of the first plate-like member at 25° C. in consideration of a state in which back holes are formed, t2 is a thickness (mm) of the second plate-like member, E2 is a volume elasticity (GPa) of the second plate-like member at 25° C., and a is a coefficient determined based on conditions during manufacturing.