Patent attributes
Provided is a method for manufacturing a printed wiring board, which can enhance the peel strength between an insulating layer and a conductive pattern by a two-step process, that is, a semi-hardening and full-hardening of the insulating layer. In the method for manufacturing the printed wiring board having one or more layers of a conductive pattern and an insulating pattern, an insulating pattern is formed on an insulating substrate, and at least one of the insulating substrate and the insulating pattern is semi-hardened. A conductive pattern is formed on the insulating substrate and/or the insulating pattern, thereby providing a stack structure. Then, a thermal treatment is performed on the stack structure to fully harden the semi-hardened insulating substrate and/or insulating pattern, and the conductive pattern is fired.
