US Patent 7714415 Leadframe structures for semiconductor packages
Patent 7714415 was granted and assigned to Intersil on May, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A semiconductor package includes a lead structure upon which a semiconductor die is mounted with at least some portion of at least some of the leads extending to, at, or across an axis or axis of the package to militate against thermally induced growth of the package and the reduce or minimize strain within the package and reliability issuse associated therewith.
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Patent Inventor Names
Louis Elliott Pflughaupt0
Nikhil Vishwanath Kelkar0
Young-Gon Kim0
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US Patent 07714415 Leadframe structures for semiconductor packages US Patent 7714415 Leadframe structures for semiconductor packages
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Patent Number
077144150
Patent Number
77144150
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Current Assignee
Patent Jurisdiction
Patent Number
077144150
Date of Patent
May 11, 2010
0Patent Application Number
114532160
Date Filed
June 15, 2006
0Official Website
Patent Primary Examiner
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US Patent 07714415 Leadframe structures for semiconductor packages
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07714415
Date of patent
May 11, 2010
Patent application number
11453216
Date Filed
June 15, 2006
Patent primary examiner
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