US Patent 7716823 Bonding an interconnect to a circuit device and related devices

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Patent Jurisdiction

Patent Number

Patent Inventor Names

Ronnie Yenchik0

Neal Meyer0

Ronald Hellekson0

Date of Patent

May 18, 2010

Patent Application Number

108220640

Date Filed

April 8, 2004

Patent Primary Examiner

Patent abstract

This disclosure relates to a system and method for bonding an interconnect to a dense circuit device with a mechanically clamping substrate.

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