Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 18, 2010
Patent Application Number
11677245
Date Filed
February 21, 2007
Patent Primary Examiner
Patent abstract
The frame plating process of the invention comprises the dry film resist pattern formation step at which a part of the dry film resist is located in such a way as to cap the upper position of the given pattern of opening concavity corresponding to the site needing film thickness precision. It is thus possible to obtain a fairly good film thickness distribution at the specific site needing film thickness precision in a simple manner yet without depending on the film thickness distribution of the plated film based on plating conditions.
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