Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 18, 2010
Patent Application Number
11873851
Date Filed
October 17, 2007
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
The present invention provides a method of coupling substrates together. The method includes providing first and second substrates and then coupling the first and second substrates together. One of the first and second substrates includes devices with an interconnect region positioned thereon and the other substrate carries a device structure.
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