Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 18, 2010
Patent Application Number
12073492
Date Filed
March 6, 2008
Patent Primary Examiner
Patent abstract
The principal objects of the present invention are to provide structure of a semiconductor device capable of reducing a bowing of a wafer, and a method for fabricating the semiconductor device. The present invention is applied to a semiconductor device, which is fabricated with a semiconductor substrate having a silicon carbide (SiC) film. The method includes the steps of: forming the SiC film on a semiconductor wafer; discriminating a deformation condition of the semiconductor wafer; and forming grooves in the SiC film, the grooves having a shape determined in accordance with the deformation condition of the semiconductor wafer.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
