Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hideki Takahashi0
Date of Patent
May 18, 2010
0Patent Application Number
119386350
Date Filed
November 12, 2007
0Patent Primary Examiner
Patent abstract
A printed wiring board is disclosed. The printed wiring board includes a board recognition mark formed of a conductive foil, a first component land covered with resist, and a second component land not covered with the resist. The board recognition mark is defined by an area of the conductive foil exposed from a resist opening having the same shape and size as the conductive foil.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.