Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 25, 2010
Patent Application Number
12049276
Date Filed
March 15, 2008
Patent Primary Examiner
Patent abstract
There is provided a method of forming a component package. The method includes the steps of providing the die pad or heat sink, forming an isolation layer on the rear surface of the die pad or heat sink and encapsulating the die pad with encapsulating material in a mold cavity after forming the isolation layer on the rear of the die pad or heat sink.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
