US Patent 7727781 Manufacture of devices including solder bumps
Patent 7727781 was granted and assigned to Agere Systems on June, 2010 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
July 22, 2008
0
Date of Patent
June 1, 2010
0
Patent Application Number
12220182
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Patent Inventor Names
Kishor V. Desai
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Brian Thomas Vaccaro
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John William Osenbach
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Joze Eura Antol
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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