Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
David R. Hembree0
William M. Hiatt0
Alan G. Wood0
Date of Patent
June 1, 2010
0Patent Application Number
121179190
Date Filed
May 9, 2008
0Patent Primary Examiner
Patent abstract
A system for fabricating semiconductor components includes a semiconductor substrate, a thinning system for thinning the semiconductor substrate, an etching system for forming the substrate opening, and a bonding system for bonding the conductive interconnect to the substrate contact. The semiconductor component can be used to form module components, underfilled components, stacked components, and image sensor semiconductor components.
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