Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Lakshmi Supriya0
Omar J. Bchir0
Date of Patent
June 1, 2010
0Patent Application Number
118242120
Date Filed
June 29, 2007
0Patent Primary Examiner
Patent abstract
In one embodiment, the present invention includes a method for forming a sacrificial material layer, patterning it to obtain a first patterned sacrificial material layer, embedding the first patterned sacrificial material layer into a dielectric material, treating the first patterned sacrificial material layer to remove it to thus provide a patterned dielectric layer having a plurality of openings in which vias may be formed. Other embodiments are described and claimed.
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