Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 1, 2010
Patent Application Number
11414374
Date Filed
May 1, 2006
Patent Primary Examiner
Patent abstract
A power QFN package includes signal leads, a die pad, support leads, and an adhesive for die bonding. These elements are encapsulated with a resin encapsulant. The lower parts of the signal leads are exposed from the resin encapsulant to function as external electrodes. A middle part of the die pad is formed at a higher level than a peripheral part thereof. This permits the formation of through holes in a thin part of the die pad. This enhances the degree of flexibility in the size of a semiconductor chip and the moisture resistance thereof.
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