Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 8, 2010
Patent Application Number
10593386
Date Filed
May 4, 2005
Patent Primary Examiner
Patent abstract
A method for adding an additional layer to an integrated circuit, the method including providing an integrated circuit having an interconnect layer, depositing, over substantially all of an exposed surface of the integrated circuit, an additional layer of material whose conductivity can be altered, and selectively altering the conductivity of a first portion of the additional layer by selective annealing, to produce a sub-circuit in the additional layer, the sub-circuit being in operative electrical communication with the integrated circuit. Related apparatus and methods are also described.
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