Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takaharu Yamano0
Date of Patent
June 8, 2010
0Patent Application Number
114216070
Date Filed
June 1, 2006
0Patent Primary Examiner
Patent abstract
A wiring board includes: a semiconductor chip; an insulating layer in which the semiconductor chip is embedded; a wiring connected to the semiconductor chip; and reinforcing layers for reinforcing the insulating layer, the reinforcing layers respectively formed on a front face side of the insulating layer and a rear face side of the insulating layer.
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