US Patent 7732892 Fuse structures and integrated circuit devices

Fuse structures and integrated circuit devices are disclosed. An exemplary embodiment of a fuse structure comprises a first and second metal pads formed at different positions in a first dielectric layer and a conductive line formed in a second dielectric layer underlying the first dielectric layer, electrically connecting the first and second pad. The conductive line is formed with at least one first portion at an end thereof and a second portion connected with the first portion, wherein the width of the first portion is greater than the width of the second portion.