US Patent 7732901 Integrated circuit package system with isloated leads
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Patent abstract
An integrated circuit package system comprising: forming a finger; forming a die pad adjacent the finger; applying a fill material around the finger and the die pad; forming a cavity in the finger and fill material; and attaching an integrated circuit die over the die pad adjacent the finger with the fill material.
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Patent Inventor Names
Abelardo Hadap Advincula, Jr.0
Henry Descalzo Bathan0
Lionel Chien Hui Tay0
Zigmund Ramirez Camacho0
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Official Website
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US Patent 07732901 Integrated circuit package system with isloated leads US Patent 7732901 Integrated circuit package system with isloated leads
Infobox
Patent Number
077329010
Patent Number
77329010
Edits on 22 Mar, 2023
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Infobox
Is a
Patent Jurisdiction
Patent Number
077329010
Date of Patent
June 8, 2010
0Patent Application Number
120504280
Date Filed
March 18, 2008
0Official Website
Patent Primary Examiner
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US Patent 07732901 Integrated circuit package system with isloated leads
Infobox
Is a
Patent jurisdiction
Patent number
07732901
Date of patent
June 8, 2010
Patent application number
12050428
Date Filed
March 18, 2008
Patent primary examiner
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