Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yutaka Maeda0
Tsubasa Sugiyama0
Date of Patent
June 8, 2010
0Patent Application Number
119558980
Date Filed
December 13, 2007
0Patent Primary Examiner
Patent abstract
A sensor mounting structure for mounting sensors onto sensor mounting portions formed on a case body includes: an elastically deformable mounting flat spring mounted on the case body so as to cover outer surface part of the case body, allowing the sensors to be mounted on the sensor mounting portions by pressing the sensors from outside. The mounting flat spring includes sensor pressing portions for pressing the sensors, a pair of pressed portions being pressed in directions nearing each other from outer surface sides by predetermined members, and engaging portions for engaging with the case body in a direction orthogonal to the directions in which the pressed portions are pressed.
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