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US Patent 7735707 Wire bonding apparatus

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Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
77357070
Patent Inventor Names
Kohei Seyama0
Date of Patent
June 15, 2010
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Patent Application Number
118277060
Date Filed
July 13, 2007
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Patent Primary Examiner
‌
Jessica L Ward
0
Patent abstract

A wire bonding apparatus including a bonding arm provided at a tip end thereof with an ultrasonic horn that has a capillary at its tip end, wherein the bonding arm is provided therein with a pressure sensor that detects the pressing load applied by the capillary on a workpiece when bonding is executed. The bonding arm has a supporting point which is a thin-connecting portion and located at a height which is the same as the height of the center of gravity of a part formed by the capillary, ultrasonic horn body portion, ultrasonic vibrator, ultrasonic horn connecting portion, etc., and at a point where a balance between inertial mass including the capillary, ultrasonic horn body part, ultrasonic horn connecting portion, horn securing screws and pressure screws and inertial mass of the ultrasonic vibrator is maintained, when the bonding arm is turned about a bonding arm supporting shaft.

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