An electrical connector assembly for electrically connecting a printed circuit board and an electronic package, comprises an electrical connector on which the electronic package is mounted, a heat sink module mounted upon the electronic package and a clip positioned upon the heat sink module. The printed circuit board defines a connector mounting area surrounded by a plurality of through holes thereof. The clip has a base portion downwardly pressing against the heat sink module, a pair of mounting portions mounted to the corresponding holes, and a pair of pressing portions extending from the mounting portions and disposed on opposite sides of the clip for pressing against the heat sink module.