US Patent 7737207 Resin composition and flexible printed circuit board
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Patent abstract
A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300° C. or above and (B) a platy inorganic filler incorporated in the resin and having the following properties;pH of aqueous dispersion: 5.5-8.0,amount of extracted alkalis: Na 30 ppm or below and K 40 ppm or below,maximum diameter a: 50 μm or below,thickness b: 1.0 μm or below, andaspect ratio (a/b): 20 or above.
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US Patent 07737207 Resin composition and flexible printed circuit board US Patent 7737207 Resin composition and flexible printed circuit board
Infobox
Patent Number
0773720700
Patent Number
773720700
Edits on 6 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
077372070
Date of Patent
June 15, 2010
0Patent Application Number
123907490
Date Filed
February 23, 2009
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
077372070
Date of Patent
June 15, 2010
0Patent Application Number
123907490
Date Filed
February 23, 2009
0Official Website
Patent Primary Examiner
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US Patent 07737207 Resin composition and flexible printed circuit board
Infobox
Is a
Patent jurisdiction
Patent number
07737207
Date of patent
June 15, 2010
Patent application number
12390749
Date Filed
February 23, 2009
Patent primary examiner
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