US Patent 7737369 Semiconductor module
All edits
Edits on 31 Oct, 2023
Golden AI
Edits made to:
Article (+516 characters)
Article
Patent abstract
A semiconductor module (A1) comprises a semiconductor device (10) provided with a semiconductor chip, and a conductive cover (6) for electromagnetic shielding bonded to the semiconductor device (10) via an adhesive coat (8). The conductive cover (6) includes a surface facing the adhesive coat (8), and the surface is formed with a convex portion (6a) protruding toward the adhesive coat (8). Around the convex portion (6a), a space (7) is formed for filling in adhesive to form the adhesive coat (8).
Edits on 21 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 20 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07737369 Semiconductor module US Patent 7737369 Semiconductor module
Infobox
Patent Number
0773736900
Patent Number
773736900
Edits on 23 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
077373690
Date of Patent
June 15, 2010
0Patent Application Number
105843360
Date Filed
December 20, 2004
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
077373690
Date of Patent
June 15, 2010
0Patent Application Number
105843360
Date Filed
December 20, 2004
0Official Website
Patent Primary Examiner
Edits on 3 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 4 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07737369 Semiconductor module
Infobox
Is a
Patent jurisdiction
Patent number
07737369
Date of patent
June 15, 2010
Patent application number
10584336
Date Filed
December 20, 2004
Patent primary examiner
Find more entities like US Patent 7737369 Semiconductor module
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
