Patent attributes
Embodiments relate to an image sensor and a method for manufacturing an image sensor. According to embodiments, a transistor structure may be manufactured on a semiconductor substrate, and an insulating layer covering the transistor structure may be formed. The insulating layer may be patterned to form a first via that may expose the semiconductor substrate, and a silicon layer may be formed on the first via and the insulating layer. The silicon layer and the insulating layer may be patterned to form a second via exposing the transistor structure, and the second via may be filled with metal to form a connecting line electrically connected with the transistor structure. Conductive impurities may be implanted into the silicon layer and may form a light receiving portion connected with the connecting line.
