Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 15, 2010
Patent Application Number
11334870
Date Filed
January 19, 2006
Patent Primary Examiner
Patent abstract
A method for electrically coupling a bond pad of an integrated circuit such as a field programmable device, an application-specific integrated circuit, or a rapid chip with an input/output device is disclosed. The bond pad is provided with a plurality of metal layers configurable for making a connection with the input/output device. The bond pad is then coupled to the input/output device with an interconnect structure. The method for electrically coupling the bond pad to the input/output device allows the customer to configure the power and ground pad counts after the slice is created.
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