US Patent 7737713 Apparatus for hot-probing integrated semiconductor circuits on wafers

An apparatus for hot-probing integrated semiconductor circuits on wafers is disclosed that includes a support device for accommodating the wafer, a measurement card with electronic circuitry for functional verification of the integrated semiconductor circuits on the wafers, and a test head with contact needles which establishes an electrical contact between the measurement card and the integrated semiconductor circuits, wherein a detachable and coolable shield plate is provided between the measurement card and wafer in order to protect the apparatus.