US Patent 7741151 Integrated circuit package formation
Patent 7741151 was granted and assigned to Freescale Semiconductor on June, 2010 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
November 6, 2008
0
Date of Patent
June 22, 2010
0
Patent Application Number
12266406
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Patent Inventor Names
William H. Lytle
0
Craig S. Amrine
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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