Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kenichi Ishikawa0
Yukihiko Hata0
Date of Patent
June 22, 2010
0Patent Application Number
118456340
Date Filed
August 27, 2007
0Patent Primary Examiner
Patent abstract
According to one embodiment, a cooling device includes a heat diffusion plate, a heat receiving portion, a heat sink and a heat pipe. The heat receiving portion is provided on the heat diffusion plate and thermally connected to an object to be cooled. The heat sink is provided on the heat diffusion plate, and it releases the heat of the heat receiving portion to outside. The heat pipe has a first end portion to be connected to the heat receiving portion and a second end portion located on an opposite side to the first end portion and to be connected to the heat sink.
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