Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 29, 2010
Patent Application Number
11364607
Date Filed
February 28, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
A solderable cover for solder attachment to an electronic substrate comprises a non-solderable cover defining an attachment pattern, a solderable metal layer in the shape of the attachment pattern, and a layer of adhesive bonding the solderable metal layer to the attachment pattern of the non-solderable cover, wherein the adhesive exhibits bond strength and resiliency sufficient to maintain the solderable metal layer attached to the non-solderable cover when raised in temperature to a melting temperature of a solder.
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