US Patent 7745258 Manufacturing method of semiconductor device
Patent 7745258 was granted and assigned to Renesas Technology Corp on June, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A manufacturing method of the semiconductor device including a step of forming solder balls on the circuit face of a mother chip, a step of making flip chip bonding of the daughter chip after the step of forming solder balls on the circuit face of the mother chip, and a step of making flip chip bonding of the mother chip on a circuit board using the solder balls.
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US Patent 07745258 Manufacturing method of semiconductor device US Patent 7745258 Manufacturing method of semiconductor device
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Patent Number
0774525800
Patent Number
774525800
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Infobox
Is a
Current Assignee
0
Patent Jurisdiction
Patent Number
077452580
Date of Patent
June 29, 2010
0Patent Application Number
121728120
Date Filed
July 14, 2008
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
0
Patent Jurisdiction
Patent Number
077452580
Date of Patent
June 29, 2010
0Patent Application Number
121728120
Date Filed
July 14, 2008
0Official Website
Patent Primary Examiner
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US Patent 07745258 Manufacturing method of semiconductor device
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07745258
Date of patent
June 29, 2010
Patent application number
12172812
Date Filed
July 14, 2008
Patent primary examiner
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