Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 29, 2010
Patent Application Number
11318637
Date Filed
December 28, 2005
Patent Primary Examiner
Patent abstract
The present invention provides a semiconductor device with a fuse part and a method of forming the same. The method includes forming a selective metal layer on a via hole which is connected to a metal line in a semiconductor device, forming a fuse metal layer on the selective metal layer, and forming a fuse metal layer pattern by using a photosensitive layer pattern which is formed on the fuse metal layer.
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