Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jon T. Woodyard0
Date of Patent
June 29, 2010
Patent Application Number
11168168
Date Filed
June 27, 2005
Patent Primary Examiner
Patent abstract
A package includes an internal package stacked upon a primary die. The package includes interconnection balls to allow the package to be electrically and physically connected to a mother board. The package is mounted to the mother board in a single operation thus minimizing labor and the associated manufacturing cost. Further, the package is tested and verified to be non-defective prior to mounting to the mother board.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
